Abstract

Thermal modelling of an industrial thin film piezo-MEMS inkjet die containing a large array of micro-actuators is presented. The paper highlights the challenges involved in modeling of a large size die (32 mm x13mm x0.5 mm) keeping the details of the very small actuators (55 µm x 1 mm x 5 µm). The predicted die temperatures are compared with the experiment. On the other hand, modelling provides further insight into some aspects (e.g. the local temperature distribution of the actuators) which are difficult to measure.